Method for manufacturing electronic component device, and electronic component device

A method for manufacturing an electronic component device, the method comprising:

• preparing a sealing structure comprising a sealing layer having two opposing main surfaces, an electronic component sealed in the sealing layer, and a connection portion connected to the electronic component, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer;
• preparing a rewiring structure comprising a rewiring portion having two opposing main surfaces, and a plurality of bumps provided on one main surface of the rewiring portion, the rewiring portion comprising rewiring connected to the plurality of bumps, and an insulating layer;
• bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating adhesive layer intervening, such that the connection portion and at least a part of the plurality of bumps are connected, thereby connecting the sealing structure and the rewiring structure;
• and
• forming a conductive shield film covering a portion not in contact with the insulating adhesive layer on an outer surface of the sealing structure connected to the rewiring structure.

A method for manufacturing an electronic component device, the method comprising:

• preparing a sealing structure comprising a sealing layer having two opposing main surfaces, an electronic component sealed in the sealing layer, and a connection portion connected to the electronic component, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer, wherein preparing the sealing structure includes:
• preparing a composite carrier base material including a support, a temporary fixing material layer, and a curable adhesive layer, which are laminated in this order;
• disposing the electronic component on the adhesive layer of the composite carrier base material, with interposing the connection portion in contact with the adhesive layer between the adhesive layer and the electronic component;
• fixing the electronic component to the composite carrier base material by curing the adhesive layer;
• forming the sealing layer sealing the electronic component on the adhesive layer;
• curing the sealing layer;
• obtaining the sealing structure comprising the adhesive layer, the electronic component, and the sealing layer, by peeling off the temporary fixing material layer from the adhesive layer;
• and
• forming the circuit surface on which the connection portion is exposed by grinding the sealing structure from the adhesive layer side, in this order;
• preparing a rewiring structure comprising a rewiring portion having two opposing main surfaces, and a plurality of bumps provided on one main surface of the rewiring portion, the rewiring portion comprising rewiring connected to the plurality of bumps, and an insulating layer;
• and
• bonding the sealing structure and the rewiring structure in a direction that the circuit surface and the plurality of bumps face each other, with an insulating adhesive layer intervening, such that the connection portion and at least a part of the plurality of bumps are connected, thereby connecting the sealing structure and the rewiring structure.