US 12,217,992 B2Granted

Methods and systems for improving transfer efficiency of an automated material handling system

AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.

InventorYen-Fu Shen

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Abstract

Methods and systems for improving the efficiency of an automated material handling system (AMHS) include providing an apparatus operatively coupled to a load port of a processing apparatus, where the apparatus is configured to remove a first work-in-process from the load port and to move the first work-in-process along a first direction to displace the first work-in-progress from the load port while a second work-in-progress is transferred to the load port from an AMHS vehicle along a second direction that is perpendicular to the first direction, and transferring the first work-in-progress to an AMHS vehicle along the second direction. The methods and systems may be used for loading and unloading wafer storage containers, such as front opening unified pods (FOUPs), in a semiconductor fabrication facility.

Claims20

Dependent claims

A positioning apparatus, comprising:

a support surface for a wafer storage container;
and
a pair of retractable hooks that are moveable in a vertical direction with respect to the support surface, wherein:
the pair of retractable hooks are configured to engage with features of a wafer storage container located on the support surface such that the wafer storage container is lifted from the support surface by a movement of the pair of retractable hooks in a vertically upwards direction from below the features of the wafer storage container,
the pair of retractable hooks retract as the pair of retractable hooks move in a vertically downward direction from above the features of a wafer storage container located on the support surface,
each retractable hook of the pair of retractable hooks is coupled to a respective support rod of a pair of support rods by a pivot joint that enables the hook to pivot between an extended position and a retracted position,
as the pair of retractable hooks are translated vertically downward a force exerted on the retractable hooks by the features of the wafer storage container located on the support surface is sufficient to cause the retractable hooks to pivot to the retracted position, and
the bias force of the spring mechanism causes the retractable hooks to return to the extended position once the hooks are lowered beneath the features of the wafer storage container such that upper surfaces of each of the retractable hooks are located directly beneath a respective feature of the wafer storage container.

5 more elements

A method of processing semiconductor wafers, comprising:

positioning a support tray of a positioning apparatus with respect to a load port to receive a second wafer storage container on the support tray while a first wafer storage container is located on an upper surface of the load port, wherein the support tray comprises a flat portion configured to support a wafer storage container and an open region interior of the flat portion that enables the support tray to lower the wafer storage container supported on the flat portion of the support tray onto the upper surface of the load port;
receiving, on the support tray, the second wafer storage container from a material handling system such that the second wafer storage container is supported on the flat portion of the support tray;
lowering the support tray towards the upper surface of the load port to place the second wafer storage container onto the upper surface of the load port after the first wafer storage container is removed from the load port;
and
moving the support tray in a horizontal direction such that the flat portion of the support tray moves in a horizontal direction between the upper surface of the load port and a lower surface of the second wafer storage container located on the upper surface of the load port.

2 more elements

A method of processing semiconductor wafers, comprising:

removing a first wafer storage container located on an upper surface of a load port by moving a support tray vertically upwards with respect to the load port, wherein the support tray comprises a flat portion configured to support a wafer storage container and an open region interior of the flat portion, and the flat portion of the support tray is located between the upper surface of the load port and a lower surface of the first wafer storage container;
positioning the support tray to enable a transfer of a second wafer storage container from a material handling system to the load port and a transfer of the first wafer storage container from the support tray to the material handling system;
and
moving the support tray in a horizontal direction such that the flat portion of the support tray moves in a horizontal direction between the upper surface of the load port and a lower surface of the second wafer storage container located on the upper surface of the load port.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 18/360,877Filed 28 Jul 2023 · continuation
Priority: 30 Aug 2021
Published: US 2023/0065660 A116 Nov 2023
Granted: 4 Feb 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10P 72/3308
Into and out of processing chamber: vertical transfer of a single workpiece
H10P 72/1918
Closed carriers: characterised by coupling elements, kinematic members, handles or elements to be externally gripped
H10P 72/3206
Between different workstations: the substrate being handled substantially vertically
H10P 72/3221
Between different workstations: overhead conveying

Family

Application17/460,390Parent of this continuation · filed 30 Aug 2021
US 2023/0369088 A1Pre-grant publication · published 16 Nov 2023
US 11,804,394 B2Parent of this continuation
US 2023/0065660 A1Published application
US 12,217,992 B2This patent

From the US filing history. Foreign family members aren’t listed.

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