Temperature controlled substrate carrier and polishing components
AssigneeAxus Technology, LLC
InventorsDaniel Ray Trojan, John Kevin Shugrue
Life of this patent
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Abstract
Temperature controlled polishing pads are disclosed. In one aspect, a CMP system includes the use of any type of atomizing system to cool or remove energy and/or heat from the polishing pad of a CMP system. The atomizing system can use of any liquid medium in combination of any compressed gas through an orifice to cool or remove the energy and/or heat from the pad, thereby allowing for higher removal rates during CMP.
Claims24
A substrate carrier head, comprising:
- a carrier body;
- a substrate retainer attached to the carrier body, the substrate retainer comprising an aperture configured to receive a substrate;
- a resilient membrane having a first surface configured to contact a surface of the substrate and a second surface opposing the first surface;
- a membrane cavity formed along the second surface of the resilient membrane;
- an inlet configured to allow liquid to flow into the membrane cavity;
- an outlet configured to allow liquid to flow from the membrane cavity;
- a regulator upstream of the inlet and configured to regulate a flow-rate of the liquid through the membrane cavity;
- and
- a liquid flow controller including a control processor configured to control the regulator to regulate the flow of the liquid through the membrane cavity during planarization of the substrate such that the flow-rate of the liquid is sufficient through the membrane cavity to adjust a temperature of the substrate during processing of the substrate.
A substrate carrier system, comprising:
- a substrate carrier head, comprising:
- a carrier body;
- a substrate retainer attached to the carrier body, the substrate retainer configured to retain a substrate on the carrier body;
- a resilient membrane having a first surface configured to contact a surface of the substrate and a second surface opposing the first surface;
- and
- a membrane cavity formed along the second surface of the resilient membrane, the membrane cavity configured to allow a liquid to flow along the second surface;
- one or more regulators upstream of the membrane cavity;
- and
- a control system including a control processor configured to control a temperature of the substrate to within a threshold of a target temperature by controlling the one or more regulators to regulate a flow-rate of the liquid through the membrane cavity during processing of the substrate.
A method for cooling a substrate during chemical mechanical polishing (CMP) of the substrate, the method comprising:
- retaining a substrate within an aperture of a substrate retainer, the substrate retainer attached to a carrier body of a carrier head including a resilient membrane;
- supplying a liquid to a membrane cavity within the carrier head, the membrane cavity formed along a surface of the resilient membrane;
- and
- using a regulator located upstream of the membrane cavity to control a flow-rate of the liquid through the membrane cavity during the CMP of the substrate such that the flow-rate of the liquid through the membrane cavity is sufficient to adjust a temperature of the substrate during processing of the substrate.
Dependencies are inferred from the claim text.