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US 12,217,976 B2Granted
Method of fabricating package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJiun-Yi Wu, Chen-Hua Yu
Life of this patent
Estimating the term…
Abstract
A method of fabrication a package and a stencil structure are provided. The stencil structure includes a first carrier having a groove and stencil units placed in the groove of the first carrier. At least one of the stencil units is slidably disposed along sidewalls of another stencil unit. Each of the stencil units has openings.
Claims20
A method of fabricating a device, comprising:
- providing a structure, wherein the structure comprises:
- a carrier;
- and
- plates, disposed in and in contact with the carrier, wherein each of the plates has a plurality of openings;
- providing a plurality of conductive terminals above the plates, and introducing the plurality of conductive terminals into the plurality of openings of the plates;
- providing a temporary carrier having a first surface and a second surface opposite to the first surface, wherein connection materials are disposed over the first surface;
- turning the first surface of the temporary carrier downward and covering top surfaces of the plurality of conductive terminals;
- flipping the temporary carrier and the structure, and then the plurality of conductive terminals in the plates are falling towards the connection materials, wherein at least one of the plates slides downward and separates from the carrier;
- and
- removing the structure.
7 more elements
A method of fabricating a package, comprising:
- providing a structure, wherein the structure comprises:
- a carrier;
- and
- plates, disposed in a groove of the carrier, wherein each of the plates has a plurality of openings;
- providing a plurality of conductive terminals above the plates, and introducing the plurality of conductive terminals into the plurality of openings of the plates;
- providing a temporary carrier, wherein connection materials are disposed over a first surface of the temporary carrier;
- overlapping the temporary carrier and the structure, wherein the first surface of the temporary carrier faces the structure and the connection materials are overlapping with the plurality of conductive terminals in the plates;
- flipping the temporary carrier and the structure together to dispose the plurality of conductive terminals over the temporary carrier;
- connecting the plurality of conductive terminals and the connection materials;
- removing the structure;
- forming an insulating encapsulation to encapsulate the plurality of conductive terminals;
- and
- grinding the insulating encapsulation and the plurality of conductive terminals, wherein top surfaces of the plurality of conductive terminals are coplanar, and the plurality of conductive terminals have different heights.
10 more elements
A method of fabricating a device, comprising:
- disposing plates in a groove of a carrier, wherein each of the plates has a plurality of openings;
- providing a plurality of conductive terminals above the plates, and introducing the plurality of conductive terminals into the plurality of openings of the plates;
- providing a temporary carrier having a first surface and a second surface opposite to the first surface, wherein connection materials are disposed over the first surface;
- turning the first surface of the temporary carrier downward and covering the carrier;
- flipping the temporary carrier and the carrier, and then the plurality of conductive terminals in the plates are falling towards the temporary carrier, wherein at least one of the plates slides downward, resulting in the at least one of the plates being at a different height compared to other ones of the plates;
- and
- removing the carrier and the plates.
4 more elements
Dependencies are inferred from the claim text.