Bonding apparatus, bonding system, and bonding method
AssigneeTokyo Electron Limited
InventorsYutaka Yamasaki, Takashi Terada
Life of this patent
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Abstract
A bonding apparatus configured to bond a first substrate and a second substrate includes: a first holder configured to hold the first substrate; a second holder disposed to face the first holder in a vertical direction, and configured to hold the second substrate; a processing vessel accommodating the first holder and the second holder therein; and a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder.
Claims9
A bonding apparatus configured to bond a first substrate and a second substrate, comprising:
- a first holder configured to hold the first substrate;
- a second holder disposed to face the first holder in a vertical direction, and configured to hold the second substrate;
- a processing vessel accommodating the first holder and the second holder therein;
- a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder;
- and
- a pressing unit provided outside the processing vessel and connected to a central portion of the first holder, the pressing unit being configured to allow the first holder to approach the second holder to press the first substrate against the second substrate,
- wherein the processing vessel comprises a first chamber provided at a first holder side and a second chamber provided at a second holder side, and is configured to be hermetically sealed by bringing the first chamber and the second chamber into contact with each other,
- the bonding apparatus further comprises an elevating mechanism configured to move the first chamber up and down, and
- a load applied to the first holder by the pressing unit in a state that the processing vessel is decompressed to be in a vacuum state is borne by a reaction force by the elevating mechanism and a pressure difference between an atmospheric pressure outside the processing vessel and a vacuum pressure inside the processing vessel.
A bonding method of bonding a first substrate and a second substrate, comprising:
- holding the first substrate by a first holder provided within a processing vessel;
- holding the second substrate by a second holder disposed within the processing vessel to face the first holder in a vertical direction;
- adjusting a horizontal position of the first holder by a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder;
- and
- allowing the first holder to approach the second holder to press the first substrate against the second substrate by a pressing unit provided outside the processing vessel and connected to a central portion of the first holder,
- wherein the processing vessel comprises a first chamber provided at a first holder side and a second chamber provided at a second holder side, and is configured to be hermetically sealed by bringing the first chamber and the second chamber into contact with each other, and
- a load applied to the first holder by the pressing unit in a state that the processing vessel is decompressed to be in a vacuum state is borne by a reaction force by an elevating mechanism configured to move the first chamber up and down and a pressure difference between an atmospheric pressure outside the processing vessel and a vacuum pressure inside the processing vessel.
Dependencies are inferred from the claim text.