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US 12,217,957 B2Granted
Engineered substrate structures for power and RF applications
AssigneeQROMIS, Inc.
InventorsVladimir Odnoblyudov, Cem Basceri, Shari Farrens
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Abstract
A substrate includes a support structure comprising a polycrystalline ceramic core, a first adhesion layer encapsulating the polycrystalline ceramic core, a barrier layer encapsulating the first adhesion layer, a second adhesion layer coupled to the barrier layer, and a conductive layer coupled to the second adhesion layer. The substrate also includes a bonding layer coupled to the support structure, a substantially single crystal silicon layer coupled to the bonding layer, and an epitaxial semiconductor layer coupled to the substantially single crystal silicon layer.
Claims11
A substrate comprising:
- a support structure comprising:
- a polycrystalline ceramic core;
- a first adhesion layer encapsulating the polycrystalline ceramic core;
- a conductive layer coupled to the first adhesion layer;
- a second adhesion layer coupled to the conductive layer;
- a barrier layer encapsulating the first adhesion layer;
- the second adhesion layer coupled to the barrier layer;
- and
- the conductive layer coupled to the second adhesion layer;
- a bonding layer coupled to the support structure;
- a substantially single crystal silicon layer coupled to the bonding layer;
- an epitaxial semiconductor layer coupled to the substantially single crystal silicon layer;
- and
- an epitaxial III-V layer coupled to the epitaxial semiconductor layer.
11 more elements
Dependencies are inferred from the claim text.