Sorption chamber walls for semiconductor equipment

A method for removing by-products using a sorption structure integrated in a portion of a chamber used for processing a substrate, the method comprising:

• cooling the sorption structure to a first temperature by circulating a coolant from a coolant source through one or more channels of a coolant delivery network defined within a middle section of the sorption structure;
• using a plurality of vacuum conduits defined in the middle section to create a low pressure region in a lattice structure defined adjacent to the middle section, the plurality of vacuum conduits being coupled to a vacuum line, wherein an outer layer of the lattice structure is exposed to an interior region of the chamber, the low pressure region causes the by-products present within the chamber to be adsorbed in a plurality of openings of the lattice structure;
• heating the sorption structure to a second temperature using one or more heating elements defined in an inner section of the sorption structure, to release the by-products that have adsorbed in the plurality of openings of the lattice structure, wherein the middle section is disposed between the inner section and the lattice structure;
• and
• removing the by-products released from the lattice structure through the plurality of vacuum conduits coupled to the vacuum line.