To an inductively coupled plasma source
AssigneeApplied Materials, Inc.
InventorsJames Rogers, John Poulose
Life of this patent
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Abstract
Disclosed herein is an apparatus for processing a substrate using an inductively coupled plasma source. An inductively coupled plasma source utilizes a power source, a shield member, and a coil coupled to the power source. In certain embodiments, the coils are arranged with a horizontal spiral grouping and a vertical extending helical grouping. The shield member, according to certain embodiments, utilizes a grounding member to function as a Faraday shield. The embodiments herein reduce parasitic losses and instabilities in the plasma created by the inductively coupled plasma in the substrate processing system.
Claims17
An apparatus for processing a substrate, comprising:
- a top plate;
- a coil comprising an inner coil and an outer coil, wherein the outer coil is disposed in a first plane, the inner coil including:
- a first segment of the inner coil in the first plane and coupled to the outer coil;
- and
- a second segment serially coupled to the first segment, wherein the second segment is configured in a vertical arrangement that extends the first segment out of the first plane and terminates at an inner diameter of the inner coil, and the second segment is separated from the outer coil by the first segment;
- and
- inner and outer stanchions coupled to the top plate, wherein the inner coil is supported by the inner stanchions and the outer coil is supported by the outer stanchions, wherein the inner and outer stanchions extend from the top plate to support the coil away from the top plate.
An apparatus for processing a substrate, comprising:
- one or more conductors, each of the one or more conductors comprising:
- an inner coil, wherein the inner coil comprises a first segment serially coupled to a second segment;
- an outer coil serially coupled to the inner coil, the outer coil disposed in a first plane, wherein the outer coil is coplanar with the first segment and configured in a second concentric planar arrangement radially outward from the first segment;
- and
- a shunt extending from the inner coil to the outer coil of the one or more conductors,
- wherein the second segment is configured in a vertical arrangement that extends at an angle from the first segment relative to the first plane and terminates at an inner diameter of the inner coil that defines an inside diameter of the one or more conductors, and
- wherein the second segment is separated from the outer coil by the first segment;
- a plurality of inner stanchions supporting the inner coil of each of the one or more conductors;
- and
- a plurality of outer stanchions supporting the outer coil of each of the one or more conductors.
An apparatus for processing a substrate, comprising:
- one or more conductors, each of the one or more conductors comprising an inner coil serially coupled to an outer coil by a shunt extending from the respective inner coil to the respective outer coil of the one or more conductors,
- wherein:
- the outer coil and the shunt are disposed in a first plane;
- the inner coil includes a first segment serially coupled to a second segment, the first segment configured in a first concentric planar arrangement in the first plane;
- the second segment extends from the first segment below and nonparallel to the first plane and is separated from the outer coil by the first segment;
- and
- the second segment is configured in a vertical-cylindrical arrangement or a vertical-helical arrangement, and the second segment terminates at an inner diameter of the inner coil that defines an inside diameter of the one or more conductors;
- one or more inner stanchions, the inner coil coupled to the one or more inner stanchions;
- and
- one or more outer stanchions, the outer coil coupled to the one or more outer stanchions.
Dependencies are inferred from the claim text.