Systems and methods for thermally conditioning a wafer in a charged particle beam apparatus

An apparatus for adjusting a charged particle beam tool with a thermal conditioning station, the apparatus comprising:

• a memory storing a set of instructions;
• and
• at least one processor configured to execute the set of instructions to cause the apparatus to perform:
• acquiring one or more characteristics of a plurality of structures on a wafer on a wafer stage, wherein a temperature of the wafer is preconditioned by the thermal conditioning station before the wafer is transferred onto the wafer stage for scanning with the charged particle beam tool;
• determining a temperature characteristic based on the one or more characteristics of the plurality of structures on the wafer;
• and
• adjusting the thermal conditioning station based on the temperature characteristic of the wafer.