Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, comprising:

• removing a reticle from a reticle pod, the reticle pod comprising:
• a base including a first surface,
• a cover including a second surface facing the first surface, the base and the cover forming an internal space housing the reticle;
• a plurality of restraining mechanisms arranged in the internal space and securing the reticle;
• and
• wall structures extending between the base and the cover and between the plurality of restraining mechanisms, the wall structures being concentrically arranged in the internal space and at least partially enclosing the reticle;
• and
• exposing the reticle to radiation to reflect patterned radiation on a photoresist coated substrate.

A method of manufacturing a semiconductor device, comprising:

• removing a reticle from a reticle pod, the reticle pod comprising:
• a base,
• a cover coupled to the base and forming an internal space therebetween, the reticle positioned in the internal space,
• a plurality of restraining mechanisms arranged in the internal space and securing the reticle, and
• a plurality of barriers concentrically disposed in the internal space and surrounding the reticle, the plurality of barriers, the base, and the cover defining a tortuous path configured to limit passage of particles between the internal space and an external environment of the reticle pod;
• and
• exposing the reticle to radiation to reflect patterned radiation on a photoresist coated substrate.