US 12,216,317 B2 · Multi-channel optical sub-assembly

Abstract

A multi-channel optical sub-assembly includes a printed circuit board with a signal processor mounted thereon, a package window mounted on the printed circuit board, the package window including a transparent material, a package mounted on the package window, and an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal, wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.

Claims20

Dependent claims

A multi-channel optical sub-assembly comprising:

a printed circuit board with a signal processor mounted thereon;
a package window mounted on the printed circuit board, the package window including a transparent material;
a package mounted on the package window;
and
an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal,
wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.

3 more elements

A method of manufacturing a multi-channel optical sub-assembly, the method comprising:

mounting an optical device, converting an electrical signal into an optical signal, on an inner portion of a package where an upper portion is opened;
sealing the upper portion of the package with a package window;
bonding an end portion of a package through electrode, buried in the package, to an end portion of a window through electrode buried in the package window;
mounting the package window, sealing the upper portion of the package, on a printed circuit board on which a signal processor generating the electrical signal is mounted;
and
bonding an other end portion of the window through electrode to an electrode of the signal processor provided on the printed circuit board.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

17/879,008Filed 2 Aug 2022

Priority

KR 10-2021-011571531 Aug 2021

Published

US 2023/0061382 A12 Mar 2023

Granted

4 Feb 2025

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

G02B 6/4251
Packages, e.g. shape, construction, internal or external details: sealed packages
G02B 6/4214
The coupling comprising intermediate optical elements, e.g. lenses, holograms: the intermediate optical element having redirecting reflective…
G02B 6/4279
Electrical aspects: radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
G02B 6/428
Electrical aspects: containing printed circuit boards [PCB]

Multi-channel optical sub-assembly

Life of this patent

Multi-channel optical sub-assembly

Life of this patent

Abstract

Claims20