Chip test pressing-down apparatus and formation method thereof

A die test pressing-down apparatus, comprising:

• a support frame capable of moving along a vertical direction;
• and
• a pressing-down block installed on the support frame, wherein a part to-be-pressed is disposed directly below the pressing-down block, wherein:
• the pressing-down block is connected to the support frame through an installation plate;
• a strip-shaped through hole is formed at an upper surface of the support frame;
• a first protruding strip is at each of lower portions of two opposite inner walls of the strip-shaped through hole;
• a corresponding second protruding strip extending directly above the first protruding strip is at each of upper portions of two opposite side surfaces of the installation plate;
• a strip-shaped block is disposed above each second protruding strip;
• and a side of the strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block extends to directly above the second protruding strip and is connected to the second protruding strip through at least two springs;
• and
• when the pressing-down block and the part to-be-pressed are spaced apart from each other, a lower surface of the second protruding strip is adjoined to be in a contact with an upper surface of a corresponding first protruding strip;
• and when a lower surface of the pressing-down block is tightly pressed with an upper surface of the part to-be-pressed, a gap is formed between the lower surface of the second protruding strip and the upper surface of the corresponding first protruding strip.