Tilt calibration for probe systems

A method to aid in a tilt calibration for probing comprising:

• mounting a device-under-test in a die bonder with a first surface of the device-under-test facing outward, wherein:
• the device-under-test has a plurality of test patterns on the first surface;
• and
• the die bonder has a spherical positioner that is adjustable in a plurality of rotational axes;
• mounting a probe device in the die bonder with a second surface of the probe device facing the first surface of the device-under-test, wherein:
• the probe device has a plurality of tilt angle sensors;
• and
• the plurality of tilt angle sensors have a plurality of spikes that protrude from the second surface;
• and
• compressing the probe device and the device-under-test together with a first force that causes a subset of the plurality of spikes to contact the plurality of test patterns;
• measuring a number of electrical connections formed between the plurality of tilt angle sensors and the plurality of test patterns;
• determining a first offset angle and a second offset angle between the first surface of the device-under-test and the second surface of the probe device based on the number of electrical connections;
• separating the probe device from the device-under-test;
• and
• adjusting the spherical positioner in one or more of the plurality of rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the first surface of the device-under-test and the second surface of the probe device.

A calibration kit comprising:

• a probe device that includes a plurality of tilt angle sensors, wherein:
• the plurality of tilt angle sensors have a plurality of spikes that protrude from a second surface of the probe device;
• and
• each of the plurality of tilt angle sensors includes two sets of the plurality of spikes;
• a device-under-test that includes a plurality of test patterns disposable on a first surface, wherein:
• each of the plurality of test patterns includes a plurality of pattern traces;
• and
• each of the plurality of pattern traces contributes a respective tilt conductance between the two sets while electrically connected to at least one spike of the plurality of spikes in each of the two sets;
• a meter operational to measure a number of electrical connections formed between the plurality of tilt angle sensors and the plurality of test patterns while compressed together;
• and
• a processor operational to determine a first offset angle and a second offset angle between the first surface of the device-under-test and the second surface of the probe device based on the number of electrical connections.