Thermal module structure

A thermal module structure, comprising:

• an aluminum base having an upper surface, a lower surface, and at least one receiving section;
• at least one copper heat pipe including a horizontally extended heat absorption section, a vertically extended heat dissipation section, and a substantially right-angled intermediate section;
• the intermediate section being connected at two ends to the heat absorption section and the heat dissipation section to give the copper heat pipe a substantially L-shaped configuration;
• and the heat absorption section being fitted in the receiving section of the aluminum base;
• a first aluminum fin assembly including a plurality of first fins provided on the upper surface of the aluminum base;
• any two adjacent first fins together defining a first air flow passage between them, and the first air flow passages being oriented perpendicular to the upper surface of the aluminum base;
• a second aluminum fin assembly including a plurality of second fins that are sequentially fastened to one another;
• every second fin being provided with at least one through hole to extend through the second fin in a thickness direction thereof for the heat dissipation section of the copper heat pipe to extend therethrough;
• any two adjacent second fins together defining a second air flow passage between them;
• and the second air flow passages being oriented parallel to the upper surface of the aluminum base to allow air flows in a direction perpendicular to the first air flow passage to flow through the second air flow passages;
• and
• at least one copper embedding layer being formed on the upper surface and the receiving section of the aluminum base and on a bottom surface of the first aluminum fin assembly;
• the upper surface of the aluminum base and the bottom surface of the first aluminum fin assembly being connected to each other via the copper embedding layers, and the receiving section on the aluminum base and the heat absorption section of the copper heat pipe also being connected to one another via the copper embedding layer.