Methods and systems for reducing adhesive strength and associated pull-off stresses

A system for adhesively bonding a first substrate to a second substrate to reduce pull-off stress during separation of the first and second substrates, the system comprising:

• a first adhesive applied over a first bonding region of a bonding area of the first substrate;
• and
• a second adhesive, which has an adhesive strength that is lower than an adhesive strength of the first adhesive, applied over a second bonding region of the bonding area of the first substrate;
• wherein the system is configured such that the first and second substrates are pressed against each other to form an adhesive bondline comprising the first and second adhesives between the first and second substrates;
• and
• wherein:
• the first substrate comprises a heat source and the second substrate comprises a heat sink;
• or
• the second substrate comprises a heat source and the first substrate comprises a heat sink.

A system for adhesively bonding a first substrate to a second substrate to reduce pull-off stress during separation of the first and second substrates, the system comprising:

• a first adhesive applied over a first bonding region of a bonding area of the first substrate;
• and
• a second adhesive, which has an adhesive strength that is lower than an adhesive strength of the first adhesive, applied over a second bonding region of the bonding area of the first substrate;
• wherein the system is configured such that the first and second substrates are pressed against each other to form an adhesive bondline comprising the first and second adhesives between the first and second substrates;
• wherein one of the first and second substrates comprises a heat source;
• wherein the system is configured, after the first and/or second adhesives have been cured, when exposed to a temperature above a predetermined softening temperature, to decrease the adhesive strength of at least the first adhesive;
• and
• wherein the softening temperature is within an operating temperature of the heat source.