Method for manufacturing package structure

A method for manufacturing a package structure, comprising:

• providing a substrate, wherein the substrate has a plurality of recesses;
• forming a plurality of first MEMS chips on the substrate, wherein each of the first MEMS chips has a through-substrate via, a lower surface of each of the first MEMS chips has a first sensor or microactuator formed on the through-substrate via, and the first sensor or the microactuator is located in one of the recesses;
• forming a plurality of first intermediate chips on the substrate, wherein each of the first intermediate chips is respectively formed on one of the first MEMS chips, wherein each of the first intermediate chips has a through-substrate via, and wherein each of the first intermediate chips comprises a signal conversion unit, a logic operation unit, a control unit, or a combination thereof;
• forming a plurality of second MEMS chips on the first intermediate chips, wherein each of the second MEMS chips has a through-substrate via, wherein an upper surface of each of the second MEMS chips has a second sensor or a microactuator formed on the through-substrate via, and wherein the package structure comprises at least one of the first sensor and the second sensor;
• and
• forming a plurality of first capping plates on the second MEMS chips, wherein each of the first capping plates provides a receiving space, and wherein the second sensor or the microactuator located on the upper surface of each of the second MEMS chips is located in the receiving space.