Method for transferring a layer to a substrate
AssigneesImec Vzw, Katholieke Universiteit Leuven, KU LEUVEN R&D
InventorsBoshen Liang, Dominika Wysocka, David Cheyns
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.
Claims20
A method comprising:
- providing a stack by:
- forming a first transfer layer over a first substrate;
- forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble;
- and
- forming a target layer in contact with the second transfer layer such that the target layer forms a top surface of the stack;
- bonding the top surface of the stack to a second substrate;
- separating the first transfer layer from the second transfer layer;
- and
- removing the second transfer layer from the target layer such that the target layer remains on the second substrate.
A method comprising:
- providing a first stack by:
- forming a first transfer layer over a first substrate;
- forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble;
- and
- forming a target layer on the second transfer layer such that the target layer forms a first top surface of the first stack;
- bonding the first top surface of the first stack to a second top surface of a second substrate stack that comprises a support structure, a patterned elastomer layer forming the second top surface, and a patterned thin film layer between the support structure and the patterned elastomer layer, wherein the patterned thin film layer comprises electronic circuitry configured for controlling a microfluidic device;
- separating the first transfer layer from the second transfer layer;
- and
- removing the second transfer layer from the target layer such that the target layer remains on the second substrate stack.
Dependencies are inferred from the claim text.