Method of manufacturing a printed circuit board and printed circuit boards formed thereby

A method of manufacturing a printed circuit board, comprising:

• 1) Imprinting an electrically conductive circuit pattern on a surface of a substrate;
• 2) Applying a surface treatment composition to the surface of the substrate over the electrically conductive circuit pattern by immersion, spin coating, or flow coating the surface treatment composition onto the surface;
• and
• 3) Allowing the surface treatment composition to form a self-assembled coating layer on the surface of the substrate in the form of a conformal coating, wherein the coating layer (ii) demonstrates a dry film thickness of 5 to 100 microns and wherein the dry film thickness of the coating layer over the surface of the substrate varies by no more than 50 percent;
• and wherein the surface treatment composition comprises:
• (a) a (meth) acrylic fluorine-containing polymer having a weight average molecular weight of 25,000 to 500,000;
• (b) a solvent containing at least one C—F bond and comprising 3-ethoxyperfluoro (2-methylhexane), 1,1,1,2,2,3,3,4,4-nonafluoro-4-methoxybutane, 1,1,1,2,2,3,3,4,4-nonafluoro-4-ethoxybutane, 1,1,1,2,3,4,4,5,5,5-Decafluoropentane and/or 1H,1H,5H-Octafluoropentyl-1,1,2,2-tetrafluoroethyl ether;
• and
• (c) a rheology modifying component comprising fumed silica that is surface modified with hydrophobic functional groups.