Display panel and manufacturing method thereof, and terminal device

A manufacturing method for a display panel, comprising:

• providing a rigid substrate, wherein the rigid substrate is divided into a display region and a bezel region surrounding the display region, the bezel region comprises a first peripheral region, a bendable region, and a binding region, and wherein the first peripheral region, the bendable region, and the binding region are sequentially arranged away from the display region;
• forming a driving circuit layer directly on the rigid substrate;
• sequentially forming a first organic layer structure, a conductive layer, and a second organic layer structure on the driving circuit layer, wherein the first organic layer structure, the conductive layer, and the second organic layer structure are distributed in at least the first peripheral region, the bendable region, and the binding region;
• peeling off the rigid substrate and the driving circuit layer in the bendable region;
• and
• bending the bendable region toward a backlight side of the display panel, so that the binding region is bent to the backlight side of the display panel.

A display panel, comprising:

• a display region;
• a bezel region surrounding the display region, wherein the bezel region comprises a first peripheral region, a bendable region, and a binding region, wherein the first peripheral region, the bendable region, and the binding region are sequentially arranged away from the display region, and wherein the binding region is bent to a backlight side of the display panel through the bendable region;
• a rigid substrate having a driving circuit layer arranged directly thereon, wherein the rigid substrate and the driving circuit layer are arranged bypassing the bendable region;
• a first organic layer structure, a conductive layer, and a second organic layer structure that are sequentially arranged away from the rigid substrate, wherein the first organic layer structure, the conductive layer, and the second organic layer structure are distributed in at least the first peripheral region, the bendable region, and the binding region, wherein the first organic layer structure in the first peripheral region is located on a side of the driving circuit layer away from the rigid substrate, and wherein the conductive layer comprises a plurality of connection leads;
• and
• a first inorganic layer structure arranged between the first organic layer structure and the conductive layer, wherein the first inorganic layer structure comprises at least one inorganic layer and is distributed in at least the first peripheral region, the bendable region, and the binding region, and wherein a material of the inorganic layer is silicon nitride or silicon oxide.