Semiconductor structure and method for forming semiconductor structure
AssigneeChangxin Memory Technologies, Inc.
InventorsRan Li, Leilei Duan, Xing Jin, Ming Cheng
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AssigneeChangxin Memory Technologies, Inc.
InventorsRan Li, Leilei Duan, Xing Jin, Ming Cheng
Estimating the term…
The embodiment of the application provides a semiconductor structure and a method for forming a semiconductor structure. The method includes: a substrate structure is provided, in which the substrate structure at least including bit line structures and a plurality of landing pads, each of the plurality of landing pads is formed around a respective one of the bit line structures and covers a part of the respective one of the bit line structures, and a gap is formed between each two adjacent landing pads of the plurality of landing pads; and capacitive structures are formed on top surfaces of the plurality of landing pads and in the gaps.
A method for forming a semiconductor structure, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.