Module

A module comprising:

• a substrate having a first surface;
• a first component mounted on the first surface;
• a resin film covering the first component along a shape of the first component, and also covering a part of the first surface;
• a first conductor film covering at least a part of the resin film along the shape of the first component, and also covering at least a part of a portion in which the resin film covers the part of the first surface;
• and
• a conductor structure disposed to extend over a part of the resin film at a location where the first conductor film covers the first surface with the resin film being interposed therebetween, wherein
• the conductor structure includes a first end portion, a second end portion, and an intermediate portion connecting the first end portion and the second end portion,
• the first end portion is connected to the first surface,
• the second end portion is also connected to the first surface, and
• the intermediate portion is in contact with the first conductor film.