Wiring substrate and method for manufacturing wiring substrate

A method for manufacturing a wiring substrate, comprising:

• forming a conductor layer including a conductor pad and a wiring pattern on a first insulating layer;
• roughening an exposed surface of the conductor layer formed on the first insulating layer;
• forming a coating film on at least portion of the exposed surface of the first conductor layer;
• forming a second insulating layer such that the second insulating layer covers the first conductor layer and the coating film;
• and
• forming a through hole in the second insulating layer such that the through hole penetrates through the second insulating layer and exposes a component accommodating part of the conductor pad,
• wherein the roughening of the exposed surface of the conductor layer includes roughening the exposed surface of the conductor pad without roughening an exposed surface of the wiring pattern of the conductor layer, the conductor pad of the conductor layer has a mounting surface including a first region and a component mounting region formed such that the second insulating layer has the through hole exposing the component mounting region and that the first region is covered by the second insulating layer, and the conductor pad of the conductor layer is formed such that the first region of the mounting surface has a surface roughness that is higher than a first surface roughness of a surface of the wiring pattern facing the second insulating layer.