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US 12,193,148 B2Granted
Module
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshihito Otsubo, Tadashi Nomura
Life of this patent
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Abstract
A module is provided that includes a wiring substrate having a major surface, a plurality of components mounted on the major surface, and a conductor incorporated resin body mounted on the major surface. Moreover, the conductor incorporated resin body is disposed between the plurality of components and includes a conductor pattern therein that is grounded.
Claims17
A module comprising:
- a wiring substrate having a first surface;
- a plurality of components mounted on the first surface;
- and
- a conductor incorporated resin body mounted on the first surface and that is disposed between the plurality of components,
- wherein the conductor incorporated resin body comprises a plurality of resin layers and a conductor pattern that is grounded and that includes a plurality of linear patterns disposed between the plurality of resin layers, such that the respective linear patterns are electrically insulated from each other by the respective resin layers that continuously extend between the respective linear patterns without any electrical interconnects extending between the respective linear patterns.
2 more elements
A module comprising:
- a wiring substrate having first surface;
- a plurality of components mounted on the first surface;
- a resin body mounted on the first surface and that is disposed between at least two components of the plurality of components;
- a sealing resin that seals at least one of the two components;
- and
- a shield film that covers at least an upper surface of the sealing resin,
- wherein the resin body comprises a plurality of resin layers and a conductor pattern hat is grounded by being electrically connected to the shield film, and
- wherein the conductor pattern includes a plurality of linear patterns disposed between the plurality of resin layers, respectively, such that the respective linear patterns are electrically insulated from each other by the respective resin layers that continuously extend between the respective linear patterns without any electrical interconnects extending between the respective linear patterns.
5 more elements
Dependencies are inferred from the claim text.