Module

A module comprising:

• a substrate having a first main surface and a second main surface that opposes the first main surface;
• an electronic component disposed on the first main surface;
• a first sealing resin disposed on the first main surface to seal the electronic component;
• a plurality of first connection terminals disposed on the second main surface;
• a second connection terminal disposed on the second main surface;
• and
• a second sealing resin disposed on the second main surface, such that an end portion of each of the first connection terminals and the second connection terminal is exposed, with each respective end portion being located opposite to the second main surface,
• wherein the second connection terminal has an area larger than an area of each of the first connection terminals when the substrate is viewed in a direction perpendicular to the second main surface, and
• wherein the second connection terminal is disposed on a straight line that connects the respective first connection terminals when the substrate is viewed in the direction perpendicular to the second main surface,
• wherein the second connection terminal establishes is configured to establish an electrical connection between the electronic component and a terminal of a motherboard when the module is mounted thereto, and
• wherein the second connection terminal does not overlap each of the plurality of first connection terminals on the second main surface in the direction perpendicular to the second main surface.