Microelectromechanical system microphone array capsule
AssigneeInvenSense, Inc.
InventorJeremy Parker
Life of this patent
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Abstract
The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.
Claims20
A microelectromechanical system (MEMS) microphone comprising:
- a MEMS microphone die;
- an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies;
- and
- an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.
A microelectromechanical system (MEMS) microphone comprising:
- a housing assembly;
- a first opening, of a first size, formed into a surface of the housing assembly;
- a sensor layer, situated parallel to the surface of the housing assembly and hermetically sealed to an interior of the housing assembly, the sensor layer comprising a MEMS acoustic sensor array having a second size that is no greater than the first size;
- a connector layer removably coupled to the sensor layer at a defined distance from the sensor layer, resulting in a gap between the sensor layer and the connector layer, wherein the connector layer is situated parallel to the sensor layer and hermetically sealed to the interior of the housing assembly;
- and
- a second opening formed into the housing assembly that exposes the gap between the sensor layer and the connector layer to an environment.
A microelectromechanical system (MEMS) microphone comprising:
- a circuit board having an opening of a first size located at a position relative to the circuit board;
- a MEMS microphone array, of the first size, situated within the opening of the circuit board;
- a housing that encapsulates the circuit board and the MEMS microphone array, wherein the housing comprises a port aperture, of a second size that is no smaller than the first size and formed into the housing at the position relative to the circuit board, resulting in a first surface of the MEMS microphone array being exposed to an environment;
- and
- a backing platform removably coupled to a second surface of the circuit board that is opposite the first surface of the MEMS microphone array, wherein the housing further encapsulates the backing platform.
Dependencies are inferred from the claim text.