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US 12,191,435 B2Granted
Semiconductor light-emitting device
AssigneeRohm Co., Ltd.
InventorMasahiko Kobayakawa
Life of this patent
Estimating the term…
Abstract
A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
Claims9
A semiconductor device comprising:
- a first portion of a lead frame including a bonding portion;
- a second portion of a lead frame spaced apart from the first portion of lead frame in a first direction perpendicular to a thickness direction of the bonding portion;
- a semiconductor element mounted on a first surface of the bonding portion and electrically connected to the first portion of lead frame and the second portion of lead frame;
- and
- a case covering a part of the first portion of lead frame and a part of the second portion of lead frame,
- wherein the bonding portion includes a first exposed surface that is opposite from the first surface and exposed from the case,
- the first portion of lead frame further includes a plurality of thin extensions and a plurality of thick extensions, each thin extension extending from the bonding portion in a second direction perpendicular to the thickness direction and the first direction, each thin extension being smaller in thickness than the bonding portion, and each thick extension extending from the bonding portion in the second direction,
- the plurality of thick extensions are disposed next to the plurality of thin extensions and have a same thickness as the bonding portion, each thick extension including a second exposed surface that is exposed from the case,
- the second exposed surface of each thick extension and the first exposed surface of the bonding portion are contained in a same flat plane, and
- the positions of the plurality of thick extensions are at different locations in the first direction from the positions of the plurality of thin extensions.
7 more elements
A semiconductor device comprising:
- a first portion of a lead frame including a bonding portion;
- a second portion of a lead frame spaced apart from the first portion of lead frame in a first direction perpendicular to a thickness direction of the bonding portion;
- a semiconductor element mounted on a first surface of the bonding portion and electrically connected to the first portion of lead frame and the second portion of lead frame;
- and
- a case covering a part of the first portion of lead frame and a part of the second portion of lead frame,
- wherein the bonding portion includes a first exposed surface that is opposite from the first surface and exposed from the case,
- the first portion of lead frame further includes a plurality of thin extensions and at least one a plurality of thick extensions, each thin extension extending from the bonding portion in a second direction perpendicular to the thickness direction and the first direction, each thin extension being smaller in thickness than the bonding portion, each thick extension extending from the bonding portion in the second direction,
- each thick extension has a same thickness as the bonding portion and includes a second exposed surface that is exposed from the case,
- the plurality of thick extensions and the plurality of thin extensions are disposed next to and spaced apart from each other in the first direction,
- the second exposed surface of each thick extension and the first exposed surface of the bonding portion are contained in a same flat plane, and
- the positions of the plurality of thick extensions are at different locations in the first direction from the positions of the plurality of thin extensions.
8 more elements
Dependencies are inferred from the claim text.