Method for making electronic device arrays using a temporary substrate
AssigneeSemiLEDS Optoelectronics Co., Ltd.
InventorsDavid Trung Doan, Trung Tri Doan
Life of this patent
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Abstract
A method for making light emitting device LED arrays includes the steps of providing a plurality of LEDs having a desired configuration (e.g., VLED, FCLED, PLED); attaching the LEDs to a carrier substrate and to a temporary substrate; forming one or more metal layers and one or more insulator layers configured to electrically connect the LEDs to form a desired circuitry; and separating the LEDs along with the layered metal layers and insulator layers that form the desired circuitry from the carrier substrate and the temporary substrate.
Claims15
A method for making electronic device arrays comprising:
- providing a plurality of separate electronic devices with at least one of the devices comprising a light emitting diode (LED);
- providing a temporary substrate configured as an attaching substrate for the electronic devices;
- attaching the electronic devices to the temporary substrate;
- forming one or more insulator layers on the electronic devices while attached to the temporary substrate;
- forming one or more metal layers configured to electrically connect the electronic devices to form a desired circuitry;
- and
- separating the electronic devices along with the metal layers and the insulator layers from the temporary substrate.
A method for making electronic device arrays comprising:
- providing a plurality of separate electronic devices with at least one of the electronic devices comprising a vertical light emitting diode (VLED) or a planar light emitting diode (PLED);
- providing a temporary substrate configured as an attaching substrate for attaching the electronic devices;
- attaching the electronic devices to the temporary substrate;
- forming one or more insulator layers on the electronic devices attached to the temporary substrate;
- forming one or more metal layers on the insulator layers configured to electrically connect the electronic devices to form a desired circuitry;
- and
- separating the electronic devices along with the metal layers and the insulator layers from the temporary substrate.
A method for making electronic device arrays comprising:
- providing a plurality of separate electronic devices, with at least one of the electronic devices comprising a light emitting diode (LED) having a desired configuration with extended pads;
- providing a temporary substrate configured as an attaching substrate for attaching the electronic devices;
- attaching the electronic devices to the temporary substrate;
- forming a plurality of metal posts on the temporary substrate in electrical contact with the electronic devices and encapsulating the metal posts in an insulator layer;
- and
- separating the electronic devices along with the metal posts and the insulator layer from the temporary substrate.
Dependencies are inferred from the claim text.