Laterally-diffused metal-oxide-semiconductor devices with an air gap
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsBong Woong Mun, Jeffrey B. Johnson
Life of this patent
Estimating the term…
Loading patent…
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsBong Woong Mun, Jeffrey B. Johnson
Estimating the term…
Structures for a laterally-diffused metal-oxide-semiconductor device and methods of forming same. The structure comprises a semiconductor substrate including a trench, a source and a drain in the semiconductor substrate, a dielectric layer inside the trench, and a gate in the dielectric layer. The trench has a first sidewall and a second sidewall, the source is adjacent to the first sidewall of the trench, the drain is adjacent to the second sidewall of the trench, and the gate is laterally between the first sidewall of the trench and the second sidewall of the trench. The structure further comprises an air gap in the dielectric layer. The air gap is below the gate, and the air gap is laterally between the first sidewall of the trench and the second sidewall of the trench.
A structure for a laterally-diffused metal-oxide-semiconductor device, the structure comprising:
A structure for a laterally-diffused metal-oxide-semiconductor device, the structure comprising:
A structure for a laterally-diffused metal-oxide-semiconductor device, the structure comprising:
Dependencies are inferred from the claim text.