Method of manufacturing semiconductor structure and semiconductor structure
AssigneeChangxin Memory Technologies, Inc.
InventorChih-Cheng Liu
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AssigneeChangxin Memory Technologies, Inc.
InventorChih-Cheng Liu
Estimating the term…
The present disclosure provides a method of manufacturing a semiconductor structure, and a semiconductor structure. The method of manufacturing a semiconductor structure includes: providing a base, where a channel is formed in the base; forming a gate conductive layer, where the gate conductive layer covers a part of the channel; and forming a semiconductor doped layer, where the semiconductor doped layer fills the channel and covers the gate conductive layer, and a doping concentration of the semiconductor doped layer at a side close to a top surface of the gate conductive layer is different from a doping concentration of the semiconductor doped layer at a side away from the top surface of the gate conductive layer.
A method of manufacturing a semiconductor structure, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.