Package structure and method of forming the same

A method of forming a package structure, comprising:

• forming a first tier comprising an organic interposer on a carrier;
• forming first connectors on the organic interposer;
• forming a second tier including a bottom die on the first tier, wherein the bottom die is electrically connected with the organic interposer through the first connectors;
• forming second connectors, third connectors and fourth connectors on the second tier;
• and forming a third tier including first dies and at least one second die on the second tier, wherein the second connectors are disposed between the first dies and the bottom die, the third connectors are disposed between the first dies and the organic interposer, and the fourth connectors are disposed between the at least one second die and the bottom die,
• wherein the first dies are electrically connected to the bottom die by the second connectors to form a signal path, the first dies are electrically connected to the organic interposer by the third connectors to form a power path, and the second connectors are located closer to the at least one second die than the third connectors.

A package structure, comprising:

• a first tier;
• a second tier disposed on the first tier;
• and
• a third tier disposed on the second tier,
• wherein the third tier is electrically connected to the second tier by a signal transmission region, the third tier is electrically connected to the first tier by a power transmission region across the second tier, and the signal transmission region has a pattern density greater than a pattern density of the power transmission region.