Package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJing-Cheng Lin, Po-Hao Tsai
Life of this patent
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Abstract
A package structure includes a first semiconductor package and a second semiconductor package over the first semiconductor package. The first semiconductor package includes a dielectric structure, a semiconductor device on the dielectric structure, under bump metallization (UBM) structures in the dielectric structure. The USB structures each include a first region and a second region surrounded by the first region. The first region has more metal layers than the second region. The bumps are respectively on the second regions of the UBM structures.
Claims20
A package structure comprising:
- a first semiconductor package comprising:
- a dielectric structure;
- a semiconductor device on the dielectric structure;
- a plurality of under bump metallization (UBM) structures in the dielectric structure, each of the plurality of UBM structures comprising a ledge and a cup-shaped portion, the ledge extending from an edge of the cup-shaped portion, wherein the ledge of each of the plurality of UBM structures comprises a seed layer, and the cup-shaped portion of each of the plurality of UBM structures is free of the seed layer;
- and
- a plurality of bumps respectively on the cup-shaped portions of the UBM structures, wherein one of the plurality of bumps is in direct contact with the seed layer of the ledge of one of the plurality of UBM structures;
- and
- a second semiconductor package over the first semiconductor package.
A package structure comprising:
- a first semiconductor package comprising:
- a dielectric structure;
- a semiconductor device on the dielectric structure;
- an UBM structure in the dielectric structure;
- and
- an redistribution line in the dielectric structure, wherein from a cross-sectional view, the redistribution line has a tapered portion in direct contact with the UBM structure, the tapered portion of the redistribution line has a width increasing as a distance from the UBM structure increases;
- and
- a second semiconductor package over the first semiconductor package.
A package structure comprising:
- a first semiconductor package comprising a dielectric structure, a semiconductor device over the dielectric structure, a first molding compound encapsulating the semiconductor device, and a plurality of through vias extending through the first molding compound;
- a plurality of electrical connectors respectively over the plurality of through vias;
- a second semiconductor package over the plurality of electrical connectors;
- and
- an underfill material encapsulating the second semiconductor package and the plurality of electrical connectors, wherein the underfill material is in contact with a top surface of the first molding compound and a top surface of the semiconductor device.
Dependencies are inferred from the claim text.