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US 12,191,280 B2Granted
Ceramic carrier and build up carrier for light-emitting diode (LED) array
AssigneeLumileds LLC
InventorsLoon-Kwang Tan, Tze Yang Hin
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Abstract
Circuit boards, LED lighting systems and methods of manufacture are described. A circuit board includes a ceramic carrier and a body on the ceramic carrier. The body includes dielectric layers and slots formed completely through a thickness of the dielectric layers. The slots are filled with a dielectric material. A conductive pad is provided on a surface of each of the slots opposite the ceramic carrier.
Claims16
A method of manufacturing a light-emitting diode (LED) lighting system, the method comprising:
- adhering a first ceramic carrier to a second ceramic carrier;
- forming a plurality of first metal pads on each of the first and second ceramic carriers with spaces between each of the plurality of first metal pads on each of the first and second ceramic carriers;
- forming a layer of a dielectric material over the plurality of first metal pads and filling the spaces between each of the plurality of first metal pads;
- forming a plurality of vias in the layer of the dielectric material with a respective one of the plurality of vias formed over each of the plurality of first metal pads;
- filling the plurality of vias with a metal material;
- and
- forming a second metal pad over each of the plurality of vias;
- and
- separating the first ceramic carrier from the second ceramic carrier after the forming the plurality of first metal pads, the forming the layer of the dielectric material, the forming the plurality of vias, the filling the plurality of vias and the forming the second metal pad.
6 more elements
Dependencies are inferred from the claim text.