Mounting apparatus

A mounting apparatus pressing a semiconductor chip arranged on a mounted body, the mounting apparatus comprising:

• a bonding stage, holding the mounted body on which the semiconductor chip is arranged;
• a base stand, supporting the bonding stage;
• a mounting head, moving in a contacting/separating direction with respect to the mounted body and to which a pressing tool that presses the semiconductor chip on the mounted body is mounted on the tip;
• and
• a film arranging mechanism, provided on the base stand and moving a cover film along the bonding stage to arrange the cover film between the semiconductor chip and the pressing tool,
• wherein the film arranging mechanism comprises:
• film guides guiding the cover film, the film guide comprising a contact portion that contacts the bonding stage and defining a height of the cover film with respect to the bonding stage;
• and
• lifting mechanisms, connected to the film guides via elastic members and lifting and lowering the film guides with respect to the bonding stage, wherein the lifting mechanism comprises a guide rail, sharing a base with the film arrangement mechanism in order that the lifting mechanism is able to move in an up-and-down direction along the guide rail affecting the height of the cover film with respect to the bonding stage.