Pre-molded leadframes in semiconductor devices
AssigneeTexas Instruments Incorporated
InventorSreenivasan K. Koduri
Life of this patent
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Abstract
In one instance, a semiconductor package includes a metal leadframe having a first plurality of openings extending partially into the leadframe from the first side and a second plurality of openings extending partially into the leadframe from the second side together forming a plurality of leads. A pre-mold compound is positioned in the second plurality of openings that at least partially supports the plurality of leads. The semiconductor package has a plurality of bumps extending from the landing sites to a semiconductor die and a molding compounding at least partially covering the plurality of bumps and the metal leadframe. Other packages and methods are disclosed.
Claims17
A semiconductor package comprising:
- a semiconductor die including a plurality of bumps electrically connected to the semiconductor die;
- a portion of a leadframe attached to the plurality of bumps, wherein the leadframe includes a first side and a second side opposing the first side, a first plurality of openings extending into the leadframe from the first side, and a second plurality of openings extending into the leadframe from the second side, the first plurality of openings including a first lateral width and the second plurality of openings including a second lateral width, wherein the second lateral width is greater than the first lateral width;
- a first molding compound covering portions of the semiconductor die, the plurality of bumps and filling the first plurality of openings;
- and
- a second molding compound filling the second plurality of openings;
- wherein each of the first plurality of openings is nonlinear in shape when viewed from a top view of the semiconductor package.
A semiconductor package comprising:
- a metal leadframe having a first side and a second side, wherein the second side is opposed to the first side, the metal leadframe comprising:
- a first plurality of openings extending partially into the leadframe from the first side, the first plurality of openings having a lateral width W1,
- a second plurality of openings extending partially into the leadframe from the second side, the second plurality of openings having a lateral width W2 that is greater than the width W1, wherein the first plurality of openings intersect the second plurality of openings to form a plurality of leads on the leadframe,
- an insulating material positioned in the second plurality of openings, wherein the insulating material at least partially supports the plurality of leads, and
- a plurality of landing sites on the first side of the leadframe between the first plurality of openings;
- a plurality of bumps extending from the landing sites to a semiconductor die;
- and
- a molding compounding at least partially covering the plurality of bumps and the metal leadframe;
- wherein each of the plurality of bumps is tapered away from the leadframe along a longitudinal axis of each of the plurality of bumps.
Dependencies are inferred from the claim text.