Antenna apparatus and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Wei Kuo, Wen-Shiang Liao
Life of this patent
Estimating the term…
Abstract
A package structure includes a first die, a second die over and electrically connected to the first die, an insulating material around the second die, a first antenna extending through the insulating material and electrically connected to the second die, the first antenna being adjacent to a first sidewall of the second die, wherein the first antenna includes a first conductive plate extending through the insulating material, and a plurality of first conductive pillars extending through the insulating material, wherein the first conductive plate is between the plurality of first conductive pillars and the first sidewall of the second die.
Claims20
A method comprising:
- bonding a first die to a second die, wherein bonding the first die to the second die comprises bonding a feed line and first conductive pad of the second die to second conductive pads of the first die;
- depositing an insulating material to surround the first die;
- etching first openings in the insulating material to expose a third conductive pad of the second die, and etching a second opening in the insulating material to expose the feed line;
- and
- depositing a conductive material in the first openings and the second opening to form a plurality of first conductive pillars in the first openings and a first conductive plate in the second opening.
A method comprising:
- bonding a top die to a bottom die, wherein bonding the top die to the bottom die comprises:
- bonding a first conductive pad of the bottom die to a second conductive pad of the top die;
- bonding a first feed line of the bottom die to a third conductive pad of the top die;
- and
- bonding a second feed line of the bottom die to a fourth conductive pad of the top die;
- encapsulating the top die with a dielectric material;
- forming a plurality of first conductive pillars that extend through the dielectric material, the plurality of first conductive pillars being electrically connected to a fifth conductive pad of the bottom die;
- and
- forming a first conductive plate that extends through the dielectric material, the first conductive plate being electrically connected to the first feed line, and wherein the plurality of first conductive pillars and the first conductive plate are adjacent to a first sidewall of the top die.
A method comprising:
- bonding a first die to a second die, wherein bonding the first die to the second die comprises forming an oxide-to-oxide bond between a first bonding layer of the first die and a second bonding layer of the second die;
- depositing a dielectric material over the second die and around the first die;
- forming a first conductive plate extending through the dielectric material and in physical contact with a first feed line of the second die, wherein the first feed line is electrically connected to the first die;
- and
- forming a first conductive grating extending through the dielectric material and electrically connected to the second die, wherein the first conductive plate and the first conductive grating are adjacent to a first sidewall of the first die.
Dependencies are inferred from the claim text.