US 12,191,264 B2 · Thermal performance improvement and stress reduction in semiconductor device modules

Abstract

In some aspects, the techniques described herein relate to a signal distribution assembly configured to conduct signals in a semiconductor device module, the signal distribution assembly including: a metal layer, the metal layer having: a first side, the first side being planar; and a second side opposite the first side, the second side being non-planar and including: a base portion; a first post extending from the base portion; and a second post extending from the base portion. The metal layer can be pre-molded using a molding compound disposed on the second side of the metal later, with respective surfaces of the first post and the second posted exposed through the molding compound, and or the metal layer can be coupled with a thermally conductive insulator (e.g., ceramic) layer.

Claims20

Dependent claims

A semiconductor device module comprising:

a substrate including:
a first ceramic layer;
and
a first metal layer disposed on a first surface of the substrate;
and
a first semiconductor die, a first side of the first semiconductor die being coupled to the first metal layer;
a second semiconductor die, a first side of the second semiconductor die being coupled to the first metal layer;
and
a signal distribution assembly including a second metal layer, the second metal layer having:
a first side, the first side being planar;
and
a second side opposite the first side, the second side being non-planar and including:
a base portion;
a first post extending from the base portion, the first post being coupled with a second side of the first semiconductor die opposite the first side of the first semiconductor die;
and
a second post extending from the base portion, the second post being coupled with a second side of the second semiconductor die opposite the first side of the second semiconductor die, the signal distribution assembly electrically coupling the first semiconductor die with the second semiconductor die.

13 more elements

Dependencies are inferred from the claim text.

Thermal performance improvement and stress reduction in semiconductor device modules

Life of this patent

Thermal performance improvement and stress reduction in semiconductor device modules

Life of this patent

Abstract

Claims20