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US 12,191,263 B2Granted
Semiconductor structure and manufacturing method of semiconductor structure
AssigneeChangxin Memory Technologies, Inc.
InventorsMengmeng Wang, Hsin-Pin Huang
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Abstract
A semiconductor structure includes a chip structure and a sealing structure disposed on a substrate of the semiconductor structure. The sealing structure includes a metal wall body and a blocking wall body located on a top of the metal wall body, and the metal wall body and the blocking wall body both are disposed around the chip structure.
Claims10
A semiconductor structure, comprising:
- a substrate;
- a chip structure and a sealing structure located on the substrate, wherein
- the sealing structure comprises a metal wall body and a blocking wall body located on a top of the metal wall body;
- and
- the metal wall body and the blocking wall body both are disposed around the chip structure;
- a sealing layer, located on a side of the sealing structure away from the substrate;
- and
- an interlayer dielectric layer and an etching stop layer, wherein the metal wall body and the blocking wall body are located in the interlayer dielectric layer and the etching stop layer, and the sealing layer covers the top surface of the interlayer dielectric layer.
5 more elements
Dependencies are inferred from the claim text.