Multi-channel gate driver package with grounded shield metal

A method of forming a multi-channel gate driver package, comprising:

• attaching a transmitter die to a first die pad, the transmitter die including first circuitry electrically connected to bond pads on the transmitter die including a first transmitter signal bond pad and a second transmitter signal bond pad;
• attaching a first receiver die to a second die pad, the first receiver including second circuitry electrically connected to a second bond pad including a second signal bond pad;
• attaching a second receiver die to a third die pad, the second receiver die including third circuitry electrically connected to third bond pads including a third signal bond pad on the third die pad;
• forming a first bond wire between the first transmitter signal bond pad and the second signal bond pad, and a second bond wire between the second transmitter signal bond pad and the signal third bond pad;
• forming a top metal layer including a first ring shield and a second ring shield on the transmitter die;
• forming a third ring shield on the first receiver die, and a fourth ring shield on the second receiver die positioned around the first, second, and the third signal bond pads, respectively;
• wirebonding to form a downbond from the third ring shield to the second die pad, and from the fourth ring shield to the third die pad;
• forming a connection electrically connecting the first and second ring shields to at least one ground pin selected from the plurality of leads;
• and
• wherein the second die pad and the third die pad, each include a direct integral connection to the ground pin.

A multi-channel gate driver package, comprising:

• a leadframe including a plurality of leads and a first die pad, a second die pad, and a third die pad;
• a transmitter die including first circuitry electrically connected to transmitter bond pads including a first transmitter signal bond pad and a second transmitter signal bond pad both on the first die pad, a first receiver die including second circuitry electrically connected to second bond pads including a on the second die pad, and a second receiver die including third circuitry electrically connected to third bond pads including at least one third signal bond pad on the third die pad;
• a first bond wire between the first transmitter signal bond pads and the second signal bond pad, and a second bond wire between the second transmitter signal bond pad and the third signal bond pad;
• a first and a second ring shield on the transmitter die positioned around the first transmitter signal bond pad and the second transmitter signal bond pad, respectively, a third ring shield on the first receiver die positioned around the second signal bond pad, and a fourth ring shield on the second receiver die positioned around the third signal bond pad, and
• a downbond from the third ring shield to the second die pad, and from the fourth ring shield to the third die pad, and
• a connection connecting the first and second transmitter ring shield to at least one ground pin selected from the plurality of leads,
• wherein the second die pad and the third die pad each include a direct integral connection to the ground pin, and
• a peninsula shaped region extending from the first die pad at least a portion of a distance to the second die pad and the third die pad, wherein the transmitter bond pads further includes a first grounding bond pad electrically connected to the first ring shield and second grounding bond pad electrically connected to the second ring shield, and wherein there is at least one downbond between the first grounding bond pad and the peninsula shaped region, and at least one downbond between the second grounding bond pad and the peninsula shaped region,
• wherein the first die pad includes the direct integral connection.