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US 12,191,257 B2Granted
Electrical bridge package with integrated off-bridge photonic channel interface
AssigneeCelestial AI Inc.
InventorAnkur Aggarwal
Life of this patent
Estimating the term…
Abstract
A circuit package is described that includes a photonic interposer, a second interposer, and a die partially overlapping and connected to both the photonic interposer and the second interposer.
Claims25
A circuit package, comprising:
- a photonic interposer;
- an electrical interposer;
- a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer, wherein the photonic interposer includes a modulator;
- and
- a plurality of electrical interconnects between the photonic interposer and the die.
2 more elements
A circuit package, comprising:
- a photonic interposer;
- an electrical interposer;
- a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer, wherein the analog-mixed signal portion includes a driver;
- and
- a plurality of electrical interconnects between the photonic interposer and the die.
2 more elements
A circuit package, comprising:
- a photonic interposer;
- an electrical interposer;
- a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer, wherein the analog-mixed signal portion includes a transimpedance amplifier (TIA);
- and
- a plurality of electrical interconnects between the photonic interposer and the die.
2 more elements
A circuit package, comprising:
- a photonic interposer;
- an electrical interposer;
- a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer;
- a plurality of electrical interconnects between the photonic interposer and the die;
- and
- a second die including a processing element, the processing element electrically connected to the electrical interposer.
3 more elements
A circuit package, comprising:
- a photonic interposer;
- an electrical interposer;
- a die including an analog-mixed signal portion and an electronic portion, the die partially overlapping both the photonic interposer and the electrical interposer, the analog-mixed signal portion connected to the photonic interposer, the electronic portion connected to the electrical interposer;
- a plurality of electrical interconnects between the photonic interposer and the die;
- and
- a fiber array unit (FAU) between the photonic interposer and the die.
3 more elements
Dependencies are inferred from the claim text.