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US 12,191,255 B2Granted
Interconnect substrate having groove around pad
AssigneeShinko Electric Industries Co., Ltd.
InventorsHikaru Tanaka, Takashi Kasuga, Tomoyuki Shimodaira, Hitoshi Kondo
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Abstract
An interconnect substrate includes a pad for external connection and an insulating layer, wherein a portion of a lower surface of the pad is covered with the insulating layer, wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer, and wherein a groove whose bottom surface is formed by the insulating layer is formed around the pad in a plan view, and has an opening on an upper surface side of the insulating layer.
Claims9
An interconnect substrate, comprising:
- a pad for external connection, the pad having an entirely planar shape;
- and
- an insulating layer,
- wherein a portion of a lower surface of the pad is in direct contact with the insulating layer,
- wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer,
- wherein a groove whose bottom surface is formed by the insulating layer completely surrounds the pad in a plan view, and has an opening on an upper surface side of the insulating layer,
- wherein a bottom surface of the groove is at a lower position than the lower surface of the pad, and
- wherein a surface of the insulating layer under the pad, which surface is in direct contact with the pad, is at a higher position than the bottom surface of the groove.
5 more elements
An interconnect substrate, comprising:
- a pad for external connection, the pad having an entirely planar shape;
- and
- an insulating layer,
- wherein a portion of a lower surface of the pad is covered with the insulating layer,
- wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer,
- wherein a groove whose bottom surface is formed by the insulating layer completely surrounds the pad in a plan view, and has an opening on an upper surface side of the insulating layer,
- wherein a bottom surface of the groove is at a lower position than the lower surface of the pad,
- wherein the pad has a single-layer structure made of a copper layer, and an organic film is formed on a surface of the pad exposed from the insulating layer, and
- wherein a surface of the insulating layer covering the lower surface of the pad extends to form an extending portion extending between a side surface of the pad and the bottom surface of the groove in a plan view, and the extending portion is at a higher position than the bottom surface of the groove.
6 more elements
Dependencies are inferred from the claim text.