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US 12,191,252 B2Granted
Semiconductor fuse with multi-bond wire
AssigneeTexas Instruments Incorporated
InventorEnis Tuncer
Life of this patent
Estimating the term…
Abstract
An electronic device has a fuse circuit including a semiconductor die and first and second bond wires, the semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit, the first bond wire having a first end coupled to the bond pad and a second end coupled to a conductive terminal, and the second bond wire having a first end coupled to the second end of the first bond wire and a second end coupled to the conductive terminal.
Claims21
An electronic device, comprising:
- a package structure;
- a conductive terminal extending outside the package structure;
- a semiconductor die having a bond pad and a fuse, the bond pad coupled to a portion of the fuse;
- a first bond wire enclosed by the package structure and having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to the conductive terminal via a ball bond;
- and
- a second bond wire enclosed by the package structure and having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal via a stitch bond.
3 more elements
An electronic device, comprising:
- a package structure;
- a conductive terminal extending outside the package structure;
- a semiconductor die having a bond pad and a fuse, the bond pad coupled to a portion of the fuse;
- a first bond wire enclosed by the package structure and having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to the conductive terminal;
- a second bond wire enclosed by the package structure and having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal;
- and
- a third bond wire enclosed by the package structure and having first and second ends, the first end of the third bond wire coupled to the first end of the second bond wire, and the second end of the third bond wire coupled to the conductive terminal.
4 more elements
A fuse circuit, comprising:
- a semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit;
- a first bond wire having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to a conductive terminal via a ball bond;
- and
- a second bond wire having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal via a stitch bond.
1 more element
A fuse circuit, comprising:
- a semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit;
- a first bond wire having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to a conductive terminal;
- and
- a second bond wire having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to the conductive terminal;
- and
- a third bond wire having first and second ends, the first end of the third bond wire coupled to the first end of the second bond wire, and the second end of the third bond wire coupled to the conductive terminal.
3 more elements
A method for fabricating an electronic device, the method comprising:
- attaching a semiconductor die to a die attach pad;
- performing a wire bonding process that includes:
- coupling a first end of a first bond wire to the bond pad, and coupling a second end of the first bond wire to a conductive terminal, and
- coupling a first end of a second bond wire to the first end of the first bond wire, and coupling a second end of the second bond wire to the conductive terminal;
- and
- performing a molding process that encloses the semiconductor die, the first and second bond wires, and a portion of the conductive terminal in a package structure.
3 more elements
An electronic device, comprising:
- a package structure;
- a conductive terminal extending outside the package structure;
- a semiconductor die having a bond pad and a fuse, the bond pad coupled to a portion of the fuse;
- a first bond wire enclosed by the package structure and having first and second ends, the first end of the first bond wire coupled to the bond pad, and the second end of the first bond wire coupled to a stud bump on the conductive terminal;
- and
- a second bond wire enclosed by the package structure and having first and second ends, the first end of the second bond wire coupled to the first end of the first bond wire, and the second end of the second bond wire coupled to another stud bump on the conductive terminal.
3 more elements
Dependencies are inferred from the claim text.