Semiconductor device having a curved part in the printed circuit board

A semiconductor device comprising:

• an insulated circuit substrate including first and second conductive layers on a top surface side;
• a first semiconductor chip mounted on the first conductive layer;
• a second semiconductor chip mounted on the second conductive layer;
• a printed circuit board including an insulating layer, a first lower-side wiring layer arranged on one main surface of the insulating layer so as to be opposed to the first semiconductor chip, and a second lower-side wiring layer arranged on the one main surface of the insulating layer so as to be opposed to the second semiconductor chip, the printed circuit board being provided with a curved part curved toward the insulated circuit substrate;
• a first connection member arranged to connect the first semiconductor chip with the first lower-side wiring layer;
• a second connection member arranged to connect the second semiconductor chip with the second lower-side wiring layer;
• a third connection member arranged to connect the first conductive layer with the second lower-side wiring layer at the curved part;
• and
• a sealing member provided to seal the first and second semiconductor chips, the printed circuit board, and the first to third connection members.