Back to results
US 12,191,240 B2Granted
Hybrid glass core for wafer level and panel level packaging applications
AssigneeIntel Corporation
InventorsJieying Kong, Srinivas Pietambaram, Gang Duan
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein include hybrid cores for electronic packaging applications. In an embodiment, a package substrate comprises a plurality of glass layers and a plurality of dielectric layers. In an embodiment, the glass layers alternate with the dielectric layers. In an embodiment, a through-hole through the plurality of glass layers and the plurality of dielectric layers is provided. In an embodiment a conductive through-hole via is disposed in the through-hole.
Claims24
A package substrate, comprising:
- a plurality of glass layers, wherein one of the plurality of glass layers has a vertical sidewall that is recessed relative to a corresponding vertical sidewall of an overlying one of the plurality of glass layers and relative to a corresponding vertical sidewall of an underlying one of the plurality of glass layers;
- a plurality of dielectric layers, wherein the glass layers alternate with the dielectric layers, and wherein each of the plurality of glass layers has a thickness greater than a thickness of each one of the plurality of dielectric layers;
- a through-hole through the plurality of glass layers and the plurality of dielectric layers;
- and
- a conductive through-hole via in the through-hole.
2 more elements
An electronic package, comprising:
- a die;
- and
- a package substrate electrically coupled to the die, wherein the package substrate comprises:
- a core, wherein the core comprises:
- a plurality of glass layers alternating with a plurality of dielectric layers, wherein each of the plurality of glass layers has a thickness greater than a thickness of each one of the plurality of dielectric layers, and wherein one of the plurality of glass layers has a vertical sidewall that is recessed relative to a corresponding vertical sidewall of an overlying one of the plurality of glass layers and relative to a corresponding vertical sidewall of an underlying one of the plurality of glass layers;
- and
- a plated through-hole via through the core.
4 more elements
A hybrid core, comprising:
- a plurality of glass layers, wherein one of the plurality of glass layers has a vertical sidewall that is recessed relative to a corresponding vertical sidewall of an overlying one of the plurality of glass layers and relative to a corresponding vertical sidewall of an underlying one of the plurality of glass layers;
- a plurality of dielectric layers, wherein each of the plurality of glass layers has a thickness greater than a thickness of each one of the plurality of dielectric layers;
- an opening through the plurality of glass layers and the plurality of dielectric layers;
- a magnetic plug lining the opening;
- and
- a plated through-hole via lining interior surfaces of the magnetic plug.
3 more elements
Dependencies are inferred from the claim text.