Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same

A device package comprising:

• an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device by direct dielectric bonds, wherein:
• the cold plate is spaced apart from the semiconductor device to collectively define a coolant chamber volume therebetween;
• the cold plate comprises a top portion having upper cavity dividers extending downwardly to define upper cavity volumes;
• a backside of the semiconductor device comprises lower cavity dividers extending upwardly to define lower cavity volumes;
• and
• the upper cavity dividers and the lower cavity dividers alternate across a horizontal length of the cold plate.