Embedded cooling systems and methods of manufacturing embedded cooling systems

A cooling assembly comprising:

• a cold plate body comprising a first side adjacent to a singulated device and an opposite second side;
• and
• a manifold lid attached to the second side, wherein:
• the cold plate body comprises a plurality of base plates arranged in a stack;
• the cold plate body is attached to the singulated device by direct dielectric-to-dielectric bonds formed between a bonding surface of the first side of the cold plate body and a bonding surface of a backside of the singulated device;
• the cold plate body and the manifold lid define one or more cavities;
• and
• the one or more cavities form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid.

A cooling assembly attached to a singulated device, the cooling assembly comprising:

• a cold plate body comprising a first side adjacent to the singulated device and an opposite second side;
• and
• a manifold lid attached to the second side, wherein:
• the cold plate body and the singulated device each comprise copper features disposed in respective bonding surfaces;
• the cold plate body is directly bonded to the singulated device by direct dielectric-to-dielectric bonds formed between the bonding surface of the first side of the cold plate body and the bonding surface of the singulated device and by direct metal bonds formed between the copper features;
• the bonding surfaces of the cold plate body and the singulated device are substantially flush with each other;
• and
• the cold plate body and the manifold lid define one or more cavities that form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid.