Semiconductor package with blind hole attachment to heat sink

A semiconductor assembly comprising:

• a heat sink;
• a semiconductor package comprising an encapsulant body of electrically insulating material, a die pad with a rear surface that is exposed from a first main face of the encapsulant body, and a fastener receptacle that comprises a blind hole in the encapsulant body or the die pad;
• and
• a fastener that is securely retained by the fastener receptacle and affixes the semiconductor package to the heat sink.

A method of producing a semiconductor package, the method comprising:

• providing a lead frame that comprises a die pad;
• mounting a semiconductor die on a die attach surface of the die pad;
• forming an encapsulant body of electrically insulating material that covers the semiconductor die and portions of the lead frame;
• and
• forming a fastener receptacle in the semiconductor package, wherein forming the fastener receptacle comprises forming a blind hole in the encapsulant body or the die pad.