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US 12,191,227 B2Granted
Heat dissipating substrate comprising diamond and semiconductor integrated device including the same
AssigneeElectronics and Telecommunications Research Institute
InventorsHyung Seok Lee, Sung-Bum Bae
Life of this patent
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Abstract
Provided is a heat dissipating substrate including a diamond substrate, wherein an upper portion of the diamond substrate has a concave-convex structure including recessed regions that are spaced apart from each other, and insulation patterns that fill the recessed regions. The insulation patterns include at least one of silicon carbide, silicon nitride, silicon oxide, aluminum nitride, and aluminum oxide.
Claims18
A heat dissipating substrate comprising:
- a diamond substrate, wherein an upper portion of the diamond substrate has a concave-convex structure including recessed regions that are spaced apart from each other;
- and
- insulation patterns that fill the recessed regions, bottom surfaces and side surfaces of the insulation patterns being in contact with the diamond substrate,
- wherein the insulation patterns include at least one of silicon carbide, silicon nitride, silicon oxide, aluminum nitride, and aluminum oxide.
1 more element
A method for manufacturing a heat dissipating substrate, comprising:
- providing a diamond substrate, wherein an upper portion of the diamond substrate has a concave-convex structure including recessed regions that are spaced apart from each other;
- forming an insulation layer, which fills the recessed regions, on a top surface of the diamond substrate;
- and
- forming insulation patterns that fill the recessed regions by planarizing the insulation layer,
- wherein bottom surfaces and side surfaces of the insulation patterns are in contact with the diamond substrate, and
- wherein the insulation patterns include at least one of silicon carbide, silicon nitride, silicon oxide, aluminum nitride, and aluminum oxide.
3 more elements
A semiconductor integrated device comprising:
- a heat dissipating substrate;
- first metal pads disposed on the heat dissipating substrate;
- and
- a semiconductor device integrated onto the heat dissipating substrate,
- wherein the semiconductor device includes electrode pads bonded to the first metal pads,
- the heat dissipating substrate includes a diamond substrate and insulation patterns disposed on an upper portion of the diamond substrate and spaced apart from each other, and
- each of the first metal pads contacts top surfaces of corresponding insulation patterns of the insulation patterns and a top surface of the diamond substrate.
4 more elements
Dependencies are inferred from the claim text.