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US 12,191,225 B2Granted
Ball grid array package design
AssigneeDell Products L.P.
InventorsQinghong He, Isaac Q. Wang
Life of this patent
Estimating the term…
Abstract
An information handling system includes a printed circuit board (PCB) and an integrated circuit device. The integrated circuit device includes a substrate and a die that is bonded via a first surface of the die to a first surface of the substrate. The substrate includes a ball grid array (BGA) on the first surface of the substrate. The integrated circuit device is bonded to a first surface of the PCB via the BGA. The die is collocated with the cutout area.
Claims20
An information handling system, comprising:
- a printed circuit board (PCB) having a cutout area;
- an integrated circuit device including a substrate and a die that is bonded via a first surface of the die to a first surface of the substrate, the substrate including a ball grid array (BGA) on the first surface of the substrate, the integrated circuit device being bonded to a first surface of the PCB via the BGA, wherein the die is collocated with the cutout area;
- and
- a cold plate extending from a second surface of the PCB through the cutout area, the cold plate being thermally coupled to a second surface of the die.
1 more element
An integrated circuit device, comprising:
- a substrate;
- and
- a die that is bonded via a first surface of the die to a first surface of the substrate, the substrate including a ball grid array (BGA) on the first surface of the substrate and a capacitor on a second surface of the substrate.
An information handling system, comprising:
- a printed circuit board (PCB) having a cutout area;
- an integrated circuit device including a substrate and a die that is bonded via a first surface of the die to a first surface of the substrate, the substrate including a ball grid array (BGA) on the first surface of the substrate, the integrated circuit device being bonded to a first surface of the PCB via the BGA, wherein the die is collocated with the cutout area;
- and
- a cold plate affixed on a second surface of the PCB and extending through the cutout area, the cold plate being thermally coupled to a second surface of the die.
1 more element
Dependencies are inferred from the claim text.