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US 12,191,218 B2Granted
Semiconductor device including surface pressure absorbing member for fastening heat sink
AssigneeMitsubishi Electric Corporation
InventorsArata Iizuka, Korehide Okamoto
Life of this patent
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Abstract
A semiconductor device includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a case made of resin, the case being mounted on the heat sink and containing the semiconductor element. A fastening hole is formed passing through the case and the heat sink. The case includes a surface pressure absorbing member on a portion including the fastening hole in plan view, the surface pressure absorbing member having a plate shape and being higher in rigidity than the resin.
Claims20
A semiconductor device comprising:
- a semiconductor element;
- a heat sink on which the semiconductor element is mounted;
- a case made of resin, the case being mounted on the heat sink and containing the semiconductor element;
- and
- a fastening hole passing through the case and the heat sink,
- wherein
- a surface pressure absorbing member is at least partially embedded in the case and positioned at portion including the fastening hole in plan view, the surface pressure absorbing member having a substantially flat plate shape and being higher in rigidity than the resin.
4 more elements
A semiconductor device comprising:
- a semiconductor element;
- a heat sink on which the semiconductor element is mounted;
- a case made of resin, the case being mounted on the heat sink and containing the semiconductor element;
- and
- a fastening hole passing through the case and the heat sink,
- wherein
- the case includes a surface pressure absorbing member on a portion including the fastening hole in plan view, the surface pressure absorbing member having a plate shape and being higher in rigidity than the resin, and
- the surface pressure absorbing member includes a portion extending on an outer peripheral portion of the case and a beam portion extending across an inside of the case.
5 more elements
Dependencies are inferred from the claim text.