Motherboard and manufacturing method for motherboard

A motherboard, comprising:

• at least one display area, a periphery area surrounding the at least one display area, a plurality of test terminals, an electrostatic discharge line, a plurality of resistors, and at least one thin film transistor;
• wherein the plurality of test terminals, the electrostatic discharge line and the plurality of resistors are located in the periphery area;
• the at least one thin film transistor is located in at least one selected from the group consisting of the at least one display area and the periphery area;
• the plurality of test terminals are electrically connected to the electrostatic discharge line through the plurality of resistors respectively;
• at least one of the plurality of resistors comprises an inorganic nonmetal trace;
• the at least one thin film transistor comprises an active layer;
• the inorganic nonmetal trace comprise a same semiconductor matrix material as the active layer of the at least one thin film transistor,
• wherein the plurality of test terminals are sequentially arranged in a first direction, and the plurality of resistors are sequentially arranged in the first direction;
• and the test terminals and the resistors are alternately arranged in the first direction,
• wherein the inorganic nonmetal trace comprises a fold-line trace, a first end of the fold-line trace is electrically connected to a corresponding one of the plurality of test terminals, and a second end of the fold-line trace is electrically connected to the electrostatic discharge line,
• wherein at least one fold-line trace is between adjacent two test terminals of the plurality of test terminals in the first direction.